Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers

Journal article


Publication Details

Author(s): Kästle C, Syed Khaja AH, Franke J
Journal: Journal of Microelectronics and Electronic Packaging
Publication year: 2017
Volume: 14
Journal issue: 2
Pages range: 63 - 69
ISSN: 1551-4897
eISSN: 1555-8037
Language: English


Abstract


Additive manufacturing (AM) provides tool-free and direct manufacturing of complex geometries simultaneously integrating various functions into components. Though AM techniques are widely used in various sectors, the application into electronics production has not yet been explored. In electronics production, substrate development has high relevance due to their multifunctionality through electrically connecting components and providing mechanical support. This contribution introduces an innovative approach based on selective laser melting (SLM) in the development of high-temperature substrates through additive layered manufacturing. Furthermore, possibilities and challenges that come along with the process combination of SLM and heavy wire bonding are investigated. Wire bonding capability is analyzed on untreated as well as on postprocessed surfaces. The influence and effectiveness of various steps of postprocessing such as cleaning, sand blasting, and grinding are analyzed. Thus, interdependencies between both manufacturing process as well as postprocessing can be revealed. The effect of surface roughness and hardness of the assembly partner are investigated as well. The primary characteristics besides the bond parameters that influence the wire bonding capability are focused in this article. The process stability and the interconnection quality are evaluated by optical nondestructive laser microscopic analysis. Destructive pull and shear tests and metallographic cross sections are performed to evaluate the adhesion characteristics. By a profound understanding of all interdependencies between the two processes, a flexible manufacturing technology for power devices can be established.



FAU Authors / FAU Editors

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Kästle, Christopher
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


How to cite

APA:
Kästle, C., Syed Khaja, A.H., & Franke, J. (2017). Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers. Journal of Microelectronics and Electronic Packaging, 14(2), 63 - 69. https://dx.doi.org/10.4071/imaps.453827

MLA:
Kästle, Christopher, Aarief Hussain Syed Khaja, and Jörg Franke. "Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers." Journal of Microelectronics and Electronic Packaging 14.2 (2017): 63 - 69.

BibTeX: 

Last updated on 2018-18-10 at 04:40