Feasibility Investigations on Selective Laser Melting for the Development of Microchannel Cooling in Power Electronics

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Details zur Publikation

Autorinnen und Autoren: Syed Khaja AH, Perinan Freire A, Kästle C, Franke J
Herausgeber: IEEE
Jahr der Veröffentlichung: 2017
Tagungsband: Proceedings of the 67th Electronic Components and Technology Conference (ECTC)
Seitenbereich: 1491--1496


Abstract


The introduction of new generation semiconductor materials into power electronics brings not only performance improvements but also technological challenges for the thermal management as the urge for high temperature operating power modules and packaging systems increases. The limiting factor for the performance and application range is not anymore the chip temperatures but the restrictions of the state-of-the-art packaging systems. Especially for high power applications, the temperatures can rise to more than 200 °C at the interconnect level. In this paper, as a contribution towards the above requirements, the selective laser melting (SLM) technique has been used to fabricate a heat sink concept which would not be feasible with conventional production techniques. Here the feasibility of producing a heat sink concept with SLM based on micro-cooling technology is successfully introduced and the thermal management performance is demonstrated. The advantages mainly for the volume and weight reduction along with performance improvement are highlighted.



FAU-Autorinnen und Autoren / FAU-Herausgeberinnen und Herausgeber

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Kästle, Christopher
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


Zitierweisen

APA:
Syed Khaja, A.H., Perinan Freire, A., Kästle, C., & Franke, J. (2017). Feasibility Investigations on Selective Laser Melting for the Development of Microchannel Cooling in Power Electronics. In IEEE (Eds.), Proceedings of the 67th Electronic Components and Technology Conference (ECTC) (pp. 1491--1496). Lake Buena Vista, US.

MLA:
Syed Khaja, Aarief Hussain, et al. "Feasibility Investigations on Selective Laser Melting for the Development of Microchannel Cooling in Power Electronics." Proceedings of the Electronic Components and Technology Conference, Lake Buena Vista Ed. IEEE, 2017. 1491--1496.

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Zuletzt aktualisiert 2018-10-08 um 20:55