Influence of grain boundaries on the deformation resistance: Insights from an investigation of deformation kinetics and microstructure of copper after predeformation by ECAP

Bach J, Liebig JP, Höppel HW, Blum W (2013)


Publication Type: Journal article

Publication year: 2013

Journal

Book Volume: 93

Pages Range: 4331-4354

Journal Issue: 35

DOI: 10.1080/14786435.2013.828161

Authors with CRIS profile

Additional Organisation(s)

Related research project(s)

How to cite

APA:

Bach, J., Liebig, J.P., Höppel, H.W., & Blum, W. (2013). Influence of grain boundaries on the deformation resistance: Insights from an investigation of deformation kinetics and microstructure of copper after predeformation by ECAP. Philosophical Magazine, 93(35), 4331-4354. https://dx.doi.org/10.1080/14786435.2013.828161

MLA:

Bach, Jochen, et al. "Influence of grain boundaries on the deformation resistance: Insights from an investigation of deformation kinetics and microstructure of copper after predeformation by ECAP." Philosophical Magazine 93.35 (2013): 4331-4354.

BibTeX: Download