Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures

Blum W, Li Y, Durst K (2009)


Publication Type: Journal article

Publication year: 2009

Journal

Book Volume: 57

Pages Range: 5207-5217

Journal Issue: 17

DOI: 10.1016/j.actamat.2009.07.030

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APA:

Blum, W., Li, Y., & Durst, K. (2009). Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures. Acta Materialia, 57(17), 5207-5217. https://doi.org/10.1016/j.actamat.2009.07.030

MLA:

Blum, Wolfgang, Yujiao Li, and Karsten Durst. "Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures." Acta Materialia 57.17 (2009): 5207-5217.

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