Co-simulation and Co-design of Chip-Package-Board Interfaces in Highly-Integrated RF Systems

Issakov V, Wojnowski M, Knapp H, Trotta S, Forstner HP, Pressel K, Hagelauer AM (2016)


Publication Type: Conference contribution

Publication year: 2016

Publisher: IEEE

Pages Range: 94-101

Event location: New Brunswick, NJ US

DOI: 10.1109/BCTM.2016.7738959

Abstract

The level of integration for RF and mm-wave systems is continuously increasing. Highly-integrated system on chip solutions have to be encapsulated in a package and assembled on a board. In addition, to be more attractive as a product, the trend goes towards further integration of passives and antennas in a package. This drives the system in package solutions. However, electrical properties of the package and board may have a significant effect on system parameters, especially at high frequencies. Hence, layout features of package and board must be carefully modelled and considered during the design. Furthermore, it is often insufficient to model chip, package and board separately, as some high-frequency effects may not be captured. An example is electromagnetic coupling between integrated coils on chip and routing traces in package. In this paper we describe considerations on co-simulation and co-design of highlyintegrated RF systems by means of accurate electromagnetic modelling. We demonstrate the approach and various aspects of chip-package-board co-design based on examples of systems for various applications: 6 GHz VCO using embedded inductor; backhaul communication system in package for V-band and Eband and a four-channel 77 GHz automotive radar transceiver in a package with four dipole antennas.

Authors with CRIS profile

Involved external institutions

How to cite

APA:

Issakov, V., Wojnowski, M., Knapp, H., Trotta, S., Forstner, H.-P., Pressel, K., & Hagelauer, A.M. (2016). Co-simulation and Co-design of Chip-Package-Board Interfaces in Highly-Integrated RF Systems. In Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) (pp. 94-101). New Brunswick, NJ, US: IEEE.

MLA:

Issakov, Vadim, et al. "Co-simulation and Co-design of Chip-Package-Board Interfaces in Highly-Integrated RF Systems." Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), New Brunswick, NJ IEEE, 2016. 94-101.

BibTeX: Download