Syed Khaja AH, Kästle C, Reinhardt A, Franke J (2013)
Publication Language: English
Publication Status: Published
Publication Type: Conference contribution, Conference Contribution
Publication year: 2013
Publisher: IEEE Computer Society
Pages Range: 11-16
Article Number: 6648206
Event location: Alba Iulia, Romania
ISBN: 9781479900367
DOI: 10.1109/ISSE.2013.6648206
This paper gives an overview on diffusion soldering or transient liquid-phase soldering (TLPS), where the conventional electronic production processes have been optimized for being capable of producing highly durable pore-free TLPS bonds. The growth of intermetallic phases (IMP) with control of temperature and time has been investigated in production line perspective. The samples processed under optimized vacuum based vapor-phase soldering along with realization of thin solder layers down to less than 10μm are demonstrated. As a result, pore-free diffusion soldered joints filled with CuSnand CuSn phases near the chip-substrate interface have been realized. Formations of IMP with changes in optimized solder profile, solder paste, chip metallization, substrate roughness and solder paste thickness are discussed. © 2013 IEEE.
APA:
Syed Khaja, A.H., Kästle, C., Reinhardt, A., & Franke, J. (2013). Optimized thin-film diffusion soldering for power-electronics production. In Proceedings of the 2013 36th International Spring Seminar on Electronics Technology, ISSE 2013 (pp. 11-16). Alba Iulia, Romania: IEEE Computer Society.
MLA:
Syed Khaja, Aarief Hussain, et al. "Optimized thin-film diffusion soldering for power-electronics production." Proceedings of the 2013 36th International Spring Seminar on Electronics Technology, ISSE 2013, Alba Iulia, Romania IEEE Computer Society, 2013. 11-16.
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