Optimized thin-film diffusion soldering for power-electronics production

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Syed Khaja AH, Kästle C, Reinhardt A, Franke J
Publisher: IEEE Computer Society
Publication year: 2013
Pages range: 11-16
ISBN: 9781479900367
Language: English


Abstract


This paper gives an overview on diffusion soldering or transient liquid-phase soldering (TLPS), where the conventional electronic production processes have been optimized for being capable of producing highly durable pore-free TLPS bonds. The growth of intermetallic phases (IMP) with control of temperature and time has been investigated in production line perspective. The samples processed under optimized vacuum based vapor-phase soldering along with realization of thin solder layers down to less than 10μm are demonstrated. As a result, pore-free diffusion soldered joints filled with CuSnand CuSn phases near the chip-substrate interface have been realized. Formations of IMP with changes in optimized solder profile, solder paste, chip metallization, substrate roughness and solder paste thickness are discussed. © 2013 IEEE.



FAU Authors / FAU Editors

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Kästle, Christopher
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Reinhardt, Andreas
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


How to cite

APA:
Syed Khaja, A.H., Kästle, C., Reinhardt, A., & Franke, J. (2013). Optimized thin-film diffusion soldering for power-electronics production. In Proceedings of the 2013 36th International Spring Seminar on Electronics Technology, ISSE 2013 (pp. 11-16). Alba Iulia, Romania: IEEE Computer Society.

MLA:
Syed Khaja, Aarief Hussain, et al. "Optimized thin-film diffusion soldering for power-electronics production." Proceedings of the 2013 36th International Spring Seminar on Electronics Technology, ISSE 2013, Alba Iulia, Romania IEEE Computer Society, 2013. 11-16.

BibTeX: 

Last updated on 2019-18-07 at 07:12