Influential parameters in the development of Transient Liquid Phase Soldering (TLPS) as a new interconnect system for high power lighting applications

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Details zur Publikation

Autorinnen und Autoren: Syed Khaja AH, Franke J
Verlag: Institute of Electrical and Electronics Engineers Inc.
Jahr der Veröffentlichung: 2015
Seitenbereich: 152-155
ISBN: 9781479988150


Abstract


This paper gives an overview on Transient Liquid-Phase Soldering (TLPS) as a new interconnect system for lighting components at package as well as chip level, where the conventional electronic production processes have been optimized for being capable of producing highly durable pore-free TLPS bonds. The growth of intermetallic phases with control of temperature, time and pressure has been investigated in production perspective. The samples processed under optimized over-pressure reflow soldering along with realization of thin solder layers down to less than 15 μm are demonstrated. As a result, TLPS joints with < 3 % voids with fully grown Sn-Cu intermetallic phases have been realized. Formations of intermetallic phase (IMP) with changes in soldering profile, solder paste height, chip metallization and substrate roughness are discussed.



FAU-Autorinnen und Autoren / FAU-Herausgeberinnen und Herausgeber

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


Zitierweisen

APA:
Syed Khaja, A.H., & Franke, J. (2015). Influential parameters in the development of Transient Liquid Phase Soldering (TLPS) as a new interconnect system for high power lighting applications. (pp. 152-155). Institute of Electrical and Electronics Engineers Inc..

MLA:
Syed Khaja, Aarief Hussain, and Jörg Franke. "Influential parameters in the development of Transient Liquid Phase Soldering (TLPS) as a new interconnect system for high power lighting applications." Proceedings of the IEEE CPMT Symposium Japan 2015, ICSJ 2015 Institute of Electrical and Electronics Engineers Inc., 2015. 152-155.

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