Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology

Beck C, Ng HJ, Agethen R, Pour Mousavi SM, Forstner HP, Wojnowski M, Pressel K, Weigel R, Hagelauer AM, Kissinger D (2016)


Publication Type: Journal article

Publication year: 2016

Journal

Publisher: IEEE

Book Volume: 16

Pages Range: 6566-6578

Journal Issue: 17

DOI: 10.1109/JSEN.2016.2587731

Abstract

We present highly integrated 60GHz radar transceivers for industrial sensor applications. The bistatic and monostatic transceivers are implemented in the SiGe bipolar technology and packaged using the embedded wafer-level ball grid array (eWLB) technology that allows for direct embedding of the antennas in the package redistribution layer. In this way, very compact and efficient radar frontends comprising all millimeter-wave components can be implemented in an 8 × 8mm2 package. These frontends were soldered on a standard low-cost PCB based on FR4 material. For verification of the proposed frontends, an FMCW radar system was developed and set up within this work. Theoretical considerations and simulations as well as corresponding measurements were carried out for the evaluation of the designed system. The demonstrator results of these embedded radar sensors show excellent system performance at a high integration level.

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APA:

Beck, C., Ng, H.J., Agethen, R., Pour Mousavi, S.M., Forstner, H.-P., Wojnowski, M.,... Kissinger, D. (2016). Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology. IEEE Sensors Journal, 16(17), 6566-6578. https://dx.doi.org/10.1109/JSEN.2016.2587731

MLA:

Beck, Christopher, et al. "Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology." IEEE Sensors Journal 16.17 (2016): 6566-6578.

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