Novel ultra-compact quad-band System-in-Package (SiP) module with IC embedded in substrate based on SESUB technology

Sieroshtan V, Sevskiy G, Komakha P, Aleksieiev O, Burygin A, Chayka O, Ruban O, Shevelov M, Kato K, Horibe A, Fujioka H, Ruffing K, Heide P, Vossiek M (2012)


Publication Language: English

Publication Status: Published

Publication Type: Conference contribution, Conference Contribution

Publication year: 2012

Pages Range: 1131-1134

Event location: San Diego, CA

URI: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84876943268&origin=inward

Abstract

This paper presents a novel ultra-compact System-in-Package (SiP) module with highly integrated wireless connectivity devices combining a set of 4 standards: WLAN, Bluetooth, FM and GPS. Besides an IC, the SiP module consists of RF filters, SMD components and a Single-Chip RF Front-end. The main IC is embedded inside the substrate and basics of SESUB technology are described. For electromagnetic compatibility and physical protection a metal EMI shield has been used. The total size of solution presented is 8.0×7.5×1. 3mm demonstrating significant miniaturization over current module technology. The embedding process and SiP module routing has shown benefits in electrical and mechanical performance.

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How to cite

APA:

Sieroshtan, V., Sevskiy, G., Komakha, P., Aleksieiev, O., Burygin, A., Chayka, O.,... Vossiek, M. (2012). Novel ultra-compact quad-band System-in-Package (SiP) module with IC embedded in substrate based on SESUB technology. In Proceedings of the 45th Annual International Symposium on Microelectronics, IMAPS 2012 (pp. 1131-1134). San Diego, CA.

MLA:

Sieroshtan, V., et al. "Novel ultra-compact quad-band System-in-Package (SiP) module with IC embedded in substrate based on SESUB technology." Proceedings of the 45th Annual International Symposium on Microelectronics, IMAPS 2012, San Diego, CA 2012. 1131-1134.

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