Tip-induced nanostructuring of Au3Cu(001) with an electrochemical scanning tunneling microscope

Beitrag in einer Fachzeitschrift
(Originalarbeit)


Details zur Publikation

Autor(en): Maupai S, Dakkouri AS, Stratmann M, Schmuki P
Zeitschrift: Journal of the Electrochemical Society
Verlag: Electrochemical Society
Jahr der Veröffentlichung: 2003
Band: 150
Heftnummer: 3
Seitenbereich: C111-C114
ISSN: 0013-4651


Abstract


Tip-induced metal deposition was employed to fabricate nanometer sized Cu clusters on AuCu(001) electrodes using an electrochemical scanning tunneling microscope (EC-STM). Due to the mixed Au and Cu termination of the substrate surface, an underpotential deposition (UPD) layer of copper covers only Au sites. Investigation of the anodic oxidation and dissolution of the Cu clusters give evidence for a strong inhibition of surface diffusion reactions due to this partial UPD layer. Based on a comparison of the nanocluster dissolution behavior with dealloying reactions of the substrate, it is concluded, that the nanostructures consist of a mixture between copper and gold due to interfacial alloying effects. This offers a novel explanation for the unexpected and unusually high stability of the clusters frequently reported in literature.



FAU-Autoren / FAU-Herausgeber

Dakkouri-Baldauf, Andrea Dr.
Lehrstuhl für Werkstoffwissenschaften (Glas und Keramik)
Schmuki, Patrik Prof. Dr.
Lehrstuhl für Werkstoffwissenschaften (Korrosion und Oberflächentechnik)


Zitierweisen

APA:
Maupai, S., Dakkouri, A.S., Stratmann, M., & Schmuki, P. (2003). Tip-induced nanostructuring of Au3Cu(001) with an electrochemical scanning tunneling microscope. Journal of the Electrochemical Society, 150(3), C111-C114. https://dx.doi.org/10.1149/1.1541007

MLA:
Maupai, Stefan, et al. "Tip-induced nanostructuring of Au3Cu(001) with an electrochemical scanning tunneling microscope." Journal of the Electrochemical Society 150.3 (2003): C111-C114.

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