A novel engineering process for spatial opto-mechatronic applications

Franke J, Zeitler JT, Reitberger T (2016)


Publication Language: English

Publication Type: Book chapter / Article in edited volumes

Publication year: 2016

Publisher: Elsivier

Edited Volumes: CIRP Annals - Manufacturing Technology

Book Volume: 65 Vol.1

Pages Range: 153-156

DOI: 10.1016/j.cirp.2016.04.091

Abstract

Well-known advantages of optical data communication, like high-speed data transmissions and higher integration densities, are the main drivers for novel applications in the field of opto-electronics. A new innovative approach is to print polymer optical waveguides on spatial circuit carriers. This allows creating highly integrated devices that unify the characteristics of electro-optical circuits with the advantages of 3D-mechatronic integrated devices (MID). This paper describes the introduction of a novel engineering method that includes technology-specific processes for creating new spatial optomechatronic applications with the focus on printing technologies and computer-aided design.

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How to cite

APA:

Franke, J., Zeitler, J.T., & Reitberger, T. (2016). A novel engineering process for spatial opto-mechatronic applications. In CIRP Annals - Manufacturing Technology. (pp. 153-156). Elsivier.

MLA:

Franke, Jörg, Jochen Tobias Zeitler, and Thomas Reitberger. "A novel engineering process for spatial opto-mechatronic applications." CIRP Annals - Manufacturing Technology. Elsivier, 2016. 153-156.

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