Resilience Articulation Point (RAP): Cross-layer Dependability Modeling for Nanometer System-on-Chip Resilience

Herkersdorf A, Aliee H, Engel M, Glaß M, Gimmler-Dumont C, Henkel J, Kleeberger VB, Kochte MA, Kühn JM, Mueller-Gritschneder D, Nassif SR, Rauchfuss H, Rosenstiel W, Schlichtmann U, Shafique M, Tahoori MB, Teich J, Wehn N, Weis C, Wunderlich HJ (2014)

Publication Type: Journal article

Publication year: 2014

Journal

Microelectronics Reliability Elsevier

Publisher: Elsevier

Book Volume: 54

Pages Range: 1066-1074

Journal Issue: 6-7

DOI: 10.1016/j.microrel.2013.12.012

Authors with CRIS profile

Hananeh Aliee Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design) Michael Glaß Juniorprofessur für Informatik Jürgen Teich Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)

Related research project(s)

Compositional System Level Reliability Analysis in the Presence of Uncertainties (CRAU) Nov. 1, 2010 - Oct. 31, 2017

Involved external institutions

Technische Universität München (TUM) DE Germany (DE) Technische Universität Dortmund DE Germany (DE) Technische Universität Kaiserslautern DE Germany (DE) Karlsruhe Institute of Technology (KIT) DE Germany (DE) Universität Stuttgart DE Germany (DE) Eberhard Karls Universität Tübingen DE Germany (DE) IBM Zurich Research Laboratory CH Switzerland (CH)

How to cite

APA:

Herkersdorf, A., Aliee, H., Engel, M., Glaß, M., Gimmler-Dumont, C., Henkel, J.,... Wunderlich, H.-J. (2014). Resilience Articulation Point (RAP): Cross-layer Dependability Modeling for Nanometer System-on-Chip Resilience. Microelectronics Reliability, 54(6-7), 1066-1074. https://dx.doi.org/10.1016/j.microrel.2013.12.012

MLA:

Herkersdorf, Andreas, et al. "Resilience Articulation Point (RAP): Cross-layer Dependability Modeling for Nanometer System-on-Chip Resilience." Microelectronics Reliability 54.6-7 (2014): 1066-1074.

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