Characterization and Optimization of Sn-Cu TLPS Interconnects for High Temperature Power Electronics through In-Situ-X-Ray Investigations

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Details zur Publikation

Autorinnen und Autoren: Syed Khaja AH, Klemm A, Zerna T, Franke J
Verlag: Institute of Electrical and Electronics Engineers Inc.
Jahr der Veröffentlichung: 2016
Seitenbereich: 1228-1234
ISBN: 9781509012039
Sprache: Englisch


Abstract


The production of reliable power modules capable of achieving higher power densities and higher junction temperatures is limited by the present assembly and packaging methods, mostly in the areas of the die-Attach and the top level interconnections. The resultant bondline consists of intermetallic compounds with higher melting point than the used interlayer material, thus making this technique applicable to high temperature applications. This work gives an overview and compares the methodologies used to realize interconnections with respect to materials, processes and customization prospects. This work investigates the diffusion soldering process with In-situ X-Ray-Analysis and provides a deeper understanding of the process conditions and the materials used. The growth of intermetallic phases (IMPs) was analyzed as well. Based on the investigations and production results, a combination of vacuum and over-pressure profile is introduced for a reliable TLPS interconnection with acceptable void percentages.



FAU-Autorinnen und Autoren / FAU-Herausgeberinnen und Herausgeber

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


Einrichtungen weiterer Autorinnen und Autoren

Technische Universität Dresden


Zitierweisen

APA:
Syed Khaja, A.H., Klemm, A., Zerna, T., & Franke, J. (2016). Characterization and Optimization of Sn-Cu TLPS Interconnects for High Temperature Power Electronics through In-Situ-X-Ray Investigations. In Proceedings of the 66th IEEE Electronic Components and Technology Conference, ECTC 2016 (pp. 1228-1234). Institute of Electrical and Electronics Engineers Inc..

MLA:
Syed Khaja, Aarief Hussain, et al. "Characterization and Optimization of Sn-Cu TLPS Interconnects for High Temperature Power Electronics through In-Situ-X-Ray Investigations." Proceedings of the 66th IEEE Electronic Components and Technology Conference, ECTC 2016 Institute of Electrical and Electronics Engineers Inc., 2016. 1228-1234.

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Zuletzt aktualisiert 2019-18-07 um 07:12