Assembly and Interconnection Technologies for MID based on Thermally Conductive Plastics for Heat Dissipation

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Details zur Publikation

Autorinnen und Autoren: Hörber J, Müller M, Franke J, Ranft F, Heinle C, Drummer D
Titel Sammelwerk: Proceedings of the International Spring Seminar on Electronics Technology
Jahr der Veröffentlichung: 2011
Tagungsband: 34th International Spring Seminar on Electronics Technology
Seitenbereich: 1-6
ISSN: 2161-2528
Sprache: Englisch


Abstract


The present study aims to display new opportunities for Molded Interconnect Devices by using thermally conductive thermoplastics as substrate materials. Therefore, a polyamide 66 polymer was modified with aluminum oxide and gains thermal conductivity above 2 W/m·K. This compound was employed for three dimensional circuit carriers with integrated cooling fins manufactured by means of injection molding. Hot embossing tests indicate that it is possible to metallize the highly filled polymers at sufficient adhesion. For mounting and interconnecting electronic components by reflow soldering in a forced convection reflow soldering oven, a homogeneous temperature distribution, due to the thermal conductivity, enables enhanced process windows. Using test specimens with mounted LEDs, results of current research work are presented dealing with evaluating thermal footprints. The aim is to optimize manufacturing as well as component cooling. © 2011 IEEE.



FAU-Autorinnen und Autoren / FAU-Herausgeberinnen und Herausgeber

Drummer, Dietmar Prof. Dr.-Ing.
Ranft, Florian
Lehrstuhl für Kunststofftechnik
Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Hörber, Johannes
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Müller, Martin
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Lehrstuhl für Kunststofftechnik


Zitierweisen

APA:
Hörber, J., Müller, M., Franke, J., Ranft, F., Heinle, C., & Drummer, D. (2011). Assembly and Interconnection Technologies for MID based on Thermally Conductive Plastics for Heat Dissipation. In 34th International Spring Seminar on Electronics Technology (pp. 1-6). High Tatras Slovakia.

MLA:
Hörber, Johannes, et al. "Assembly and Interconnection Technologies for MID based on Thermally Conductive Plastics for Heat Dissipation." Proceedings of the 34th International Spring Seminar on Electronics Technology, High Tatras Slovakia 2011. 1-6.

BibTeX: 

Zuletzt aktualisiert 2018-09-08 um 22:41