Assembly and Interconnection Technologies for MID based on Thermally Conductive Plastics for Heat Dissipation

Conference contribution


Publication Details

Author(s): Hörber J, Müller M, Franke J, Ranft F, Heinle C, Drummer D
Title edited volumes: Proceedings of the International Spring Seminar on Electronics Technology
Publication year: 2011
Conference Proceedings Title: 34th International Spring Seminar on Electronics Technology
Pages range: 1-6
ISSN: 2161-2528
Language: English


Abstract


The present study aims to display new opportunities for Molded Interconnect Devices by using thermally conductive thermoplastics as substrate materials. Therefore, a polyamide 66 polymer was modified with aluminum oxide and gains thermal conductivity above 2 W/m·K. This compound was employed for three dimensional circuit carriers with integrated cooling fins manufactured by means of injection molding. Hot embossing tests indicate that it is possible to metallize the highly filled polymers at sufficient adhesion. For mounting and interconnecting electronic components by reflow soldering in a forced convection reflow soldering oven, a homogeneous temperature distribution, due to the thermal conductivity, enables enhanced process windows. Using test specimens with mounted LEDs, results of current research work are presented dealing with evaluating thermal footprints. The aim is to optimize manufacturing as well as component cooling. © 2011 IEEE.



FAU Authors / FAU Editors

Drummer, Dietmar Prof. Dr.-Ing.
Lehrstuhl für Kunststofftechnik
Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Hörber, Johannes
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Müller, Martin
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Ranft, Florian
Lehrstuhl für Kunststofftechnik


How to cite

APA:
Hörber, J., Müller, M., Franke, J., Ranft, F., Heinle, C., & Drummer, D. (2011). Assembly and Interconnection Technologies for MID based on Thermally Conductive Plastics for Heat Dissipation. In 34th International Spring Seminar on Electronics Technology (pp. 1-6). High Tatras Slovakia.

MLA:
Hörber, Johannes, et al. "Assembly and Interconnection Technologies for MID based on Thermally Conductive Plastics for Heat Dissipation." Proceedings of the 34th International Spring Seminar on Electronics Technology, High Tatras Slovakia 2011. 1-6.

BibTeX: 

Last updated on 2018-09-08 at 22:41