Additive Copper Metallization of Semiconductors for Enabling a Copper Wire Bonding Process

Hensel A, Müller M, Kohlmann-von Platen K, Franke J (2017)

Publication Language: English

Publication Type: Conference contribution, Conference Contribution

Publication year: 2017

Conference Proceedings Title: Proceedings of 40th International Spring Seminar on Electronics Technology (ISSE)

Event location: Sofia BG

Abstract

Current societal and political trends such as climate protection have brought demands and regulations for ever-increasing efficiency in energy applications. The decentralized supply of energy and the integration of regenerative energy sources are also demands which concern both politics and society as well as industry. Especially the electronics industry with power electronics is developing rapidly under these trends and always finds new fields of application. Here, power modules function as a link between energy sources and energy consumers. Consequently, high demands are placed on an efficient assembly and connection technology of future power electronics modules. Current technologies, such as wire bonding, have limitations in terms of compact design and thermal management, thereby focusing on improved interconnect technologies and materials. In the framework of this paper, a plasma- based coating process for the additive copper coating of semiconductors in order to enable a copper wire bonding process is presented.

Authors with CRIS profile

Alexander Hensel Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Martin Muckelbauer Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

How to cite

APA:

Hensel, A., Müller, M., Kohlmann-von Platen, K., & Franke, J. (2017). Additive Copper Metallization of Semiconductors for Enabling a Copper Wire Bonding Process. In Proceedings of 40th International Spring Seminar on Electronics Technology (ISSE) (Eds.), Proceedings of 40th International Spring Seminar on Electronics Technology (ISSE). Sofia, BG.

MLA:

Hensel, Alexander, et al. "Additive Copper Metallization of Semiconductors for Enabling a Copper Wire Bonding Process." Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), Sofia Ed. Proceedings of 40th International Spring Seminar on Electronics Technology (ISSE), 2017.

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