DPSK modulated wakeup mechanism for point-to-point networks with partial network support

Beitrag bei einer Tagung
(Konferenzbeitrag)


Details zur Publikation

Autor(en): Seyler J, Rahimov S, Streichert T, Glaß M, Teich J
Verlag: IEEE Computer Society
Jahr der Veröffentlichung: 2014
Tagungsband: Proceedings of the 9th IEEE International Symposium on Industrial Embedded Systems (SIES)
Seitenbereich: 238-243
ISBN: 9781479940233


Abstract


The automotive community introduced Ethernet as a packet-switched point-to-point network. Possible fields of application are telematics, advanced driving assistance and a backbone. Currently, CAN, FlexRay and MOST are used to interconnect these applications. With Ethernet the bandwidth is rising but the networking requirements are still the same as for existing field buses. Consumer Ethernet does not provide a wakeup mechanism that is sufficient for automotive systems. As a solution, this paper introduces a novel DPSK based physical-layer mechanism which uses digital signals to identify partial networks and has an overall wakeup latency of less than 5 ms which is a reduction of 75 % for a five-hop network to the current state-of-the-art technology for automotive point-to-point networks. © 2014 IEEE.



FAU-Autoren / FAU-Herausgeber

Glaß, Michael Prof. Dr.-Ing.
Juniorprofessur für Informatik
Streichert, Thilo Dr.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)
Teich, Jürgen Prof. Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)


Autor(en) der externen Einrichtung(en)
Daimler AG


Zitierweisen

APA:
Seyler, J., Rahimov, S., Streichert, T., Glaß, M., & Teich, J. (2014). DPSK modulated wakeup mechanism for point-to-point networks with partial network support. In Proceedings of the 9th IEEE International Symposium on Industrial Embedded Systems (SIES) (pp. 238-243). Pisa, IT: IEEE Computer Society.

MLA:
Seyler, Jan, et al. "DPSK modulated wakeup mechanism for point-to-point networks with partial network support." Proceedings of the 9th IEEE International Symposium on Industrial Embedded Systems, SIES 2014, Pisa IEEE Computer Society, 2014. 238-243.

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