Design and solder process optimization in MID technology for high power applications

Authored book
(Volume of book series)


Publication Details

Author(s): Syed Khaja AH, Kästle C
Publisher: Trans Tech Publications Ltd
Publication year: 2014
Volume: 1038
Pages range: 107-112
ISBN: 9783038352525
Language: English


Abstract


Molded interconnect device (MID) technology is a key enabling technology with growing markets in automotive, communications, consumer electronics through integration with lighting and sensor technologies. The MID technology is yet to be explored for high temperature applications in automotive or consumer lighting. One of the hindering factors for such implementation in the serial production and time to market is the improper electronic and thermal packaging of the light emitting diodes (LEDs) on the MID substrates. This paper addresses the optimization of mold design, surface metallization and soldering process for the effective thermal management of the high-power LED systems. By using a simulation model, the thermal distribution and the resultant decrease in temperatures for varying forward electrical currents in high-power LEDs by design optimization is demonstrated. In addition, the optimization of solder process with respect to solder profile in context of vacuum vapor-phase soldering for void-free solder connections is discussed.



FAU Authors / FAU Editors

Kästle, Christopher
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


How to cite

APA:
Syed Khaja, A.H., & Kästle, C. (2014). Design and solder process optimization in MID technology for high power applications. Trans Tech Publications Ltd.

MLA:
Syed Khaja, Aarief Hussain, and Christopher Kästle. Design and solder process optimization in MID technology for high power applications. Trans Tech Publications Ltd, 2014.

BibTeX: 

Last updated on 2018-02-12 at 20:50