A novel approach for thin-film Ag-sintering process through Aerosol Jet Printing in power electronics

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Syed Khaja AH, Hörber J, Gruber C, Franke J
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication year: 2015
ISBN: 9780956808622
Language: English


Abstract


The growing demand for highly reliable and compact power electronic modules capable of operating at high switching frequencies and temperatures require optimized interconnection and packaging technologies. This holds true also for conventional electronics for usage at elevated temperatures, which allows additional options for miniaturization and high system integration without complicated cooling concepts. However, new materials and cost-effective manufacturing concepts are required. This contribution introduces a modified approach to produce thin-film silver sintered interconnections through Aerosol Jet Printing (AJP), which offers high degree of customization and design flexibility. The sintering process for silver nano-inks through AJP for power electronic die-Attach has been introduced. Power electronic assemblies had been constructed and high-Temperature shear tests up to 400°C had been performed to demonstrate the potential of the realized thin-film silver joints.



FAU Authors / FAU Editors

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Hörber, Johannes
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


How to cite

APA:
Syed Khaja, A.H., Hörber, J., Gruber, C., & Franke, J. (2015). A novel approach for thin-film Ag-sintering process through Aerosol Jet Printing in power electronics. Institute of Electrical and Electronics Engineers Inc..

MLA:
Syed Khaja, Aarief Hussain, et al. "A novel approach for thin-film Ag-sintering process through Aerosol Jet Printing in power electronics." Proceedings of the 20th European Microelectronics and Packaging Conference and Exhibition, EMPC 2015 Institute of Electrical and Electronics Engineers Inc., 2015.

BibTeX: 

Last updated on 2018-08-08 at 04:11