Advanced substrate and packaging concepts for compact system integration with additive manufacturing technologies for high temperature applications

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Syed Khaja AH, Schwarz D, Franke J
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication year: 2015
Pages range: 156-159
ISBN: 9781479988150


Abstract


Additive manufacturing is one of the key technologies which poses as an energy and resource efficient alternative of conventional subtractive and formative technologies. In this contribution, additive layered manufacturing mainly selective laser melting (SLM) is investigated to check the potential for system integration and packaging concepts. This paper gives an overview on the limitations of conventional molded integrated devices for high temperature applications. For high temperature stability, ceramic substrates were additively functionalized with copper based powder material using SLM technique. Focus of the work lies in the melting of the metal powder directly on ceramic substrate and producing a reliable metal-ceramic bond. The process influencing parameters such as laser power, velocity, scan concepts were tested to check the bonding characteristics. Initial shear tests and current carrying tests were performed to check the mechanical and electrical stability. The proof-of-concept was demonstrated by developing a prototype in automotive lighting application. The potential of SLM for high-temperature applicability is further discussed.



FAU Authors / FAU Editors

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Schwarz, Daniel
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


How to cite

APA:
Syed Khaja, A.H., Schwarz, D., & Franke, J. (2015). Advanced substrate and packaging concepts for compact system integration with additive manufacturing technologies for high temperature applications. In Proceedings of the IEEE CPMT Symposium Japan 2015, ICSJ 2015 (pp. 156-159). Institute of Electrical and Electronics Engineers Inc..

MLA:
Syed Khaja, Aarief Hussain, Daniel Schwarz, and Jörg Franke. "Advanced substrate and packaging concepts for compact system integration with additive manufacturing technologies for high temperature applications." Proceedings of the IEEE CPMT Symposium Japan 2015, ICSJ 2015 Institute of Electrical and Electronics Engineers Inc., 2015. 156-159.

BibTeX: 

Last updated on 2019-18-07 at 07:23