Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies

Hagelauer AM, Wojnowski M, Pressel K, Weigel R, Kissinger D (2018)

Publication Language: English

Publication Type: Journal article, Review article

Publication year: 2018

Journal

IEEE Microwave Magazine Institute of Electrical and Electronics Engineers (IEEE)

Book Volume: 19

Pages Range: 48-56

Journal Issue: 1

DOI: 10.1109/MMM.2017.2759558

Authors with CRIS profile

Amelie Marietta Hagelauer Lehrstuhl für Technische Elektronik Robert Weigel Lehrstuhl für Technische Elektronik Dietmar Kissinger Lehrstuhl für Technische Elektronik

Involved external institutions

Infineon Technologies AG DE Germany (DE)

How to cite

APA:

Hagelauer, A.M., Wojnowski, M., Pressel, K., Weigel, R., & Kissinger, D. (2018). Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies. IEEE Microwave Magazine, 19(1), 48-56. https://dx.doi.org/10.1109/MMM.2017.2759558

MLA:

Hagelauer, Amelie Marietta, et al. "Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies." IEEE Microwave Magazine 19.1 (2018): 48-56.

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