Selective Laser Melting for Additive Manufacturing of High-Temperature Ceramic Circuit Carriers

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Syed Khaja AH, Franke J
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication year: 2016
Pages range: 837-842
ISBN: 9781509012039
Language: English


Abstract


Additive manufacturing (AM) is one of the key technologies which poses as an energy and resource efficient alternative to conventional subtractive and formative technologies. In this contribution, additive layered manufacturing mainly selective laser melting (SLM) is investigated to check the potential for substrate manufacturing, system integration and packaging concepts in electronic systems. The challenge for an optimal mechatronic integrated device design is to simultaneously consider both the application-specific requirements and to integrate advantages of molded interconnect device (MID) technology. This work focuses on the process development for the generation of conductive patterns on ceramic substrates by SLM. The process influencing parameters such as laser power, velocity and scan concepts were tested to check the bonding characteristics. The obtained layer thicknesses and the corresponding process-generated failure mechanisms and the mechanical stability are presented. The potential of SLM for high temperature applicability is further discussed.



FAU Authors / FAU Editors

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


How to cite

APA:
Syed Khaja, A.H., & Franke, J. (2016). Selective Laser Melting for Additive Manufacturing of High-Temperature Ceramic Circuit Carriers. (pp. 837-842). Institute of Electrical and Electronics Engineers Inc..

MLA:
Syed Khaja, Aarief Hussain, and Jörg Franke. "Selective Laser Melting for Additive Manufacturing of High-Temperature Ceramic Circuit Carriers." Proceedings of the 66th IEEE Electronic Components and Technology Conference, ECTC 2016 Institute of Electrical and Electronics Engineers Inc., 2016. 837-842.

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Last updated on 2018-21-11 at 13:50