Investigations of Copper Wire Bonding Capability on Plasma Based Additive Copper Metallizations

Beitrag bei einer Tagung
(Konferenzbeitrag)


Details zur Publikation

Autorinnen und Autoren: Hensel A, Kohlmann-von Platen K, Franke J
Jahr der Veröffentlichung: 2017
Tagungsband: Proceedings of the Proceedings of the 19th Electronics Packaging Technology Conference
ISBN: 978-1-5386-3041-9
Sprache: Englisch


Abstract


This paper describes and discusses a novel manufacturing


process that enables an advanced top-level interconnection for


power electronic applications. The commonly used aluminum


bond wire process, where a friction welded connection is


performed by the usage of ultrasonic on the substrate as well


as on the semiconductor, is replaced by copper as a wire


material. Thus, the overall performance of power electronic


modules can be increased significantly because of the


preeminent material characteristics of copper. However,


the higher hardness and lower ductility of copper in


comparison to aluminum presuppose a functional coating on


the silicon layers that absorbs the high bonding forces and


protects the crystal structures from shattering. Different


approaches for a selective copper metallization like galvanic


metallization have been investigated and provide a usable


coating quality. Disadvantageously the processes are neither


very flexible nor cost-effective and have also a bad


environmental impact. The technology described in the


following uses a current stabilized argon plasma to melt single


copper particles which are then accelerated towards the


substrate. Upon impact, the coating material solidifies and


creates a diffusion-based adhesive layer on which the copper


bonding process can be performed.


FAU-Autorinnen und Autoren / FAU-Herausgeberinnen und Herausgeber

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Hensel, Alexander
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


Zitierweisen

APA:
Hensel, A., Kohlmann-von Platen, K., & Franke, J. (2017). Investigations of Copper Wire Bonding Capability on Plasma Based Additive Copper Metallizations. In Proceedings of the Proceedings of the 19th Electronics Packaging Technology Conference. Singapore.

MLA:
Hensel, Alexander, Klaus Kohlmann-von Platen, and Jörg Franke. "Investigations of Copper Wire Bonding Capability on Plasma Based Additive Copper Metallizations." Proceedings of the Electronics Packaging Technology Conference, Singapore 2017.

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Zuletzt aktualisiert 2018-25-08 um 07:09