Investigations of Copper Wire Bonding Capability on Plasma Based Additive Copper Metallizations

Hensel A, Kohlmann-von Platen K, Franke J (2017)

Publication Language: English

Publication Type: Conference contribution, Conference Contribution

Publication year: 2017

Conference Proceedings Title: Proceedings of the 19th Electronics Packaging Technology Conference

Event location: Singapore SG

ISBN: 978-1-5386-3041-9

DOI: 10.1109/EPTC.2017.8277588

Abstract

This paper describes and discusses a novel manufacturing process that enables an advanced top-level interconnection for power electronic applications. The commonly used aluminum bond wire process, where a friction welded connection is performed by the usage of ultrasonic on the substrate as well as on the semiconductor, is replaced by copper as a wire material. Thus, the overall performance of power electronic modules can be increased significantly because of the preeminent material characteristics of copper. However, the higher hardness and lower ductility of copper in comparison to aluminum presuppose a functional coating on the silicon layers that absorbs the high bonding forces and protects the crystal structures from shattering. Different approaches for a selective copper metallization like galvanic metallization have been investigated and provide a usable coating quality. Disadvantageously the processes are neither very flexible nor cost-effective and have also a bad environmental impact. The technology described in the following uses a current stabilized argon plasma to melt single copper particles which are then accelerated towards the substrate. Upon impact, the coating material solidifies and creates a diffusion-based adhesive layer on which the copper bonding process can be performed.

Authors with CRIS profile

Alexander Hensel Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

How to cite

APA:

Hensel, A., Kohlmann-von Platen, K., & Franke, J. (2017). Investigations of Copper Wire Bonding Capability on Plasma Based Additive Copper Metallizations. In Proceedings of the 19th Electronics Packaging Technology Conference. Singapore, SG.

MLA:

Hensel, Alexander, Klaus Kohlmann-von Platen, and Jörg Franke. "Investigations of Copper Wire Bonding Capability on Plasma Based Additive Copper Metallizations." Proceedings of the Electronics Packaging Technology Conference, Singapore 2017.

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