Inkjet printing of highly conductive nanoparticle dispersions for organic electronics

Maisch P, Tam KC, Fecher FW, Egelhaaf HJ, Brabec C, Scheiber H, Maier E (2016)


Publication Language: English

Publication Status: Published

Publication Type: Conference contribution, Conference Contribution

Publication year: 2016

Publisher: Institute of Electrical and Electronics Engineers Inc.

Article Number: 7738932

Event location: Würzburg DE

ISBN: 9781509054282

DOI: 10.1109/ICMID.2016.7738932

Abstract

Inkjet printing of conductive nanoparticle dispersions and their use in organic electronic devices for multiple purposes like contact pads and electrodes is demonstrated. In this context, we show the printing of semitransparent silver grid/Poly(3,4-ethylene-dioxythiophene) :poly(styrenesulfonate) (PEDOT:PSS) electrodes and their application in organic photovoltaics (OPV). The cell performance was optimized using finite element simulations accounting for electrical and optical layer properties as well as resolution restrictions given by the inkjet. Furthermore, we demonstrate inkjet printing of silver nanowires (AgNW) and their use as percolation electrode. Characterization reveals low sheet resistance of less than 20 Ω/□ together with a high specular transmittance of more than 90 %, indicating the excellent quality of the inkjet printed layers. Applying them as cathode and anode, fully inkjet printed semitransparent solar cells with power conversion efficiencies (PCE) of up to 4.3 % on an active area of > 1 cm are demonstrated.

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How to cite

APA:

Maisch, P., Tam, K.C., Fecher, F.W., Egelhaaf, H.J., Brabec, C., Scheiber, H., & Maier, E. (2016). Inkjet printing of highly conductive nanoparticle dispersions for organic electronics. In Proceedings of the 12th International Congress on Molded Interconnect Devices, MID 2016. Würzburg, DE: Institute of Electrical and Electronics Engineers Inc..

MLA:

Maisch, Philipp, et al. "Inkjet printing of highly conductive nanoparticle dispersions for organic electronics." Proceedings of the 12th International Congress on Molded Interconnect Devices, MID 2016, Würzburg Institute of Electrical and Electronics Engineers Inc., 2016.

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