Functionalization of Silver Nanowires Surface using Ag-C Bonds in a Sequential Reductive Method

Bashouti MY, Resch S, Ristein J, Mackovic M, Spiecker E, Waldvogel SR, Christiansen SH (2015)


Publication Status: Published

Publication Type: Journal article

Publication year: 2015

Journal

Publisher: American Chemical Society

Book Volume: 7

Pages Range: 21657-21661

Journal Issue: 39

DOI: 10.1021/acsami.5b06830

Abstract

Silver nanowires (Ag-NW) assembled in interdigitated webs have shown an applicative potential as transparent and conducting electrodes. However, upon integration in practical device designs, the presence of silver oxide, which instantaneously forms on the Ag-NW surfaces in ambient conditions, is unwanted. Here, we report on the functionalization of Ag-NWs with 4-nitrophenyl moieties through A-C bonds using a versatile two step reduction process, i.e., ascorbate reduction combined electrografting. We show that 40% of the Ag atop sites were terminated and provide high surface stability toward oxidation for more than 2 months while keeping the same intrinsic conductivity as in bulk silver.

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How to cite

APA:

Bashouti, M.Y., Resch, S., Ristein, J., Mackovic, M., Spiecker, E., Waldvogel, S.R., & Christiansen, S.H. (2015). Functionalization of Silver Nanowires Surface using Ag-C Bonds in a Sequential Reductive Method. ACS Applied Materials and Interfaces, 7(39), 21657-21661. https://dx.doi.org/10.1021/acsami.5b06830

MLA:

Bashouti, Muhammad Y., et al. "Functionalization of Silver Nanowires Surface using Ag-C Bonds in a Sequential Reductive Method." ACS Applied Materials and Interfaces 7.39 (2015): 21657-21661.

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