Runtime Stress-Aware Replica Placement on Reconfigurable Devices under Safety Constraints

Beitrag bei einer Tagung


Details zur Publikation

Autor(en): Angermeier J, Ziener D, Glaß M, Teich J
Titel Sammelwerk: 2011 International Conference on Field-Programmable Technology, FPT 2011
Verlag: IEEE Press
Verlagsort: New York, NY, USA
Jahr der Veröffentlichung: 2011
Tagungsband: Proceedings of the International Conference on Field-Programmable Technology
ISBN: 978-1-4577-1741-3


Abstract


Ever shrinking device structures result in an increased susceptibility of modern embedded systems to radiation and temperature-dependent aging effects. This work introduces a runtime placement algorithm for dynamically reconfigurable systems that have to meet varying safety requirements. The algorithm first allocates replicas of modules to cope with soft-errors and meet the safety-level of the module and then places the modules onto the FPGA in such a way that the stress, and therefore aging, is minimized. For the replica allocation, a lifetime analysis is employed to predict the reliability of a module depending on its sensitive configuration bits and the expected runtime of the module. Moreover, the temperature profile of each active module is utilized to predict the degradation of each part of the reconfigurable area. The presented algorithm then equally distributes active modules to minimize the degradation effects while respecting placement constraints that arise from the need for majority voting between the different replicas of a module. A case study gives evidence of the capability of the proposed online placing algorithm to harden a system against radiation effects and meet safety constraints while extending the overall lifetime of the reconfigurable device by minimizing stress. © 2011 IEEE.



FAU-Autoren / FAU-Herausgeber

Angermeier, Josef Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)
Glaß, Michael Prof. Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)
Teich, Jürgen Prof. Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)
Ziener, Daniel Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)


Zitierweisen

APA:
Angermeier, J., Ziener, D., Glaß, M., & Teich, J. (2011). Runtime Stress-Aware Replica Placement on Reconfigurable Devices under Safety Constraints. In Proceedings of the International Conference on Field-Programmable Technology. New Delhi, IN: New York, NY, USA: IEEE Press.

MLA:
Angermeier, Josef, et al. "Runtime Stress-Aware Replica Placement on Reconfigurable Devices under Safety Constraints." Proceedings of the International Conference on Field-Programmable Technology (FPT'11), New Delhi New York, NY, USA: IEEE Press, 2011.

BibTeX: 

Zuletzt aktualisiert 2018-09-08 um 22:55