Variability Modelling Throughout the Product Line Lifecycle

Elsner C (2009)


Publication Type: Conference contribution

Publication year: 2009

Journal

Publisher: Springer-verlag

Edited Volumes: Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics)

City/Town: Berlin/Heidelberg, Germany

Book Volume: 5795

Pages Range: (to appear)

Conference Proceedings Title: Proceedings of the ACM/IEEE 12th International Conference on Model Driven Engineering Languages and Systems (MODELS 2009), Empirical Results Track

Event location: Denver, Colorado, USA

ISBN: 978-3-642-04424-3

URI: http://www4.informatik.uni-erlangen.de/Publications/2009/elsner_09_models.pdf

DOI: 10.1007/978-3-642-04425-0

Abstract

This paper summarizes our experience with introducing feature modelling into several product lines within Siemens. Feature models are used for solving various tasks in the product line lifecycle, starting with scoping the reusable asset base up to support for actual product configuration. Using feature models as primary artefacts for managing variability early in the lifecycle, we could improve the efficiency and transparency of scoping activities considerably and made the development efforts way easier to schedule. On the other end of the lifecycle, feature models lowered the engineering efforts in solution business in supporting product configuration and instantiation. © 2009 Springer Berlin Heidelberg.

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How to cite

APA:

Elsner, C. (2009). Variability Modelling Throughout the Product Line Lifecycle. In Proceedings of the ACM/IEEE 12th International Conference on Model Driven Engineering Languages and Systems (MODELS 2009), Empirical Results Track (pp. (to appear)). Denver, Colorado, USA: Berlin/Heidelberg, Germany: Springer-verlag.

MLA:

Elsner, Christoph. "Variability Modelling Throughout the Product Line Lifecycle." Proceedings of the ACM/IEEE 12th International Conference on Model Driven Engineering Languages and Systems (MODELS 2009), Denver, Colorado, USA Berlin/Heidelberg, Germany: Springer-verlag, 2009. (to appear).

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