System Concept of a Robust and Reproducible Plasma-Based Coating Process for the Manufacturing of Power Electronic Applications

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Hensel A, Müller M, Franke J, Kohlmann-von Platen K
Editor(s): Robert Schmitt; Günther Schuh (Hrsg.):
Publisher: Apprimus Verlag, Aachen, 2017 Wissenschaftsverlag des Instituts für Industriekommunikation und Fachmedien an der RWTH Aachen Steinbachstr. 25, 52074 Aachen Internet: www.apprimus-verlag.de, E-Mail: info@apprimus-verlag.de
Publishing place: Aachen
Publication year: 2017
Conference Proceedings Title: 7. WGP-Jahreskongress Aachen, 5.-6. Oktober 2017
Pages range: 79-85
ISBN: 978-3-86359-555-5
Language: German


Abstract


The increasing integration of power electronics in various applications like energy


distribution, hybrid and electric mobility or consumer products requires a steady improvement of


interconnection technologies in order to increase reliability, efficiency and life expectancy of power


modules.


Currently the standard technology used for top level interconnection is the aluminum wire bonding


process. Thereby wires are friction welded both on dies and substrates by the use of ultrasonic in


order to create a local cohesively connection. Due to the limitation of aluminum regarding the


mechanical, thermal, and electric characteristics, the use of alternative materials like copper is


preferred. However, due to the higher hardness of copper, copper wire bonding on the previous


aluminum metallization of the components is not possible, so that an additional copper metallization


is necessary to be applied. Common processes for the metallization of semiconductors like PVD or


galvanic metallization are either expensive or require extensive follow up processes like back etching.


In order to provide another suitable method a plasma based coating unit for copper particles has been


installed.


FAU Authors / FAU Editors

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Hensel, Alexander
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Müller, Martin
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


How to cite

APA:
Hensel, A., Müller, M., Franke, J., & Kohlmann-von Platen, K. (2017). System Concept of a Robust and Reproducible Plasma-Based Coating Process for the Manufacturing of Power Electronic Applications. In Robert Schmitt; Günther Schuh (Hrsg.): (Eds.), 7. WGP-Jahreskongress Aachen, 5.-6. Oktober 2017 (pp. 79-85). RWTH Aachen: Aachen: Apprimus Verlag, Aachen, 2017 Wissenschaftsverlag des Instituts für Industriekommunikation und Fachmedien an der RWTH Aachen Steinbachstr. 25, 52074 Aachen Internet: www.apprimus-verlag.de, E-Mail: info@apprimus-verlag.de.

MLA:
Hensel, Alexander, et al. "System Concept of a Robust and Reproducible Plasma-Based Coating Process for the Manufacturing of Power Electronic Applications." Proceedings of the 7. WGP Jahreskongress, RWTH Aachen Ed. Robert Schmitt; Günther Schuh (Hrsg.):, Aachen: Apprimus Verlag, Aachen, 2017 Wissenschaftsverlag des Instituts für Industriekommunikation und Fachmedien an der RWTH Aachen Steinbachstr. 25, 52074 Aachen Internet: www.apprimus-verlag.de, E-Mail: info@apprimus-verlag.de, 2017. 79-85.

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Last updated on 2018-10-08 at 21:41