Electrical and mechanical investigations on copper circuit paths coated on fiber-reinforced plastics by atmospheric plasma technology

Schramm R, Reitberger T, Franke J (2015)

Publication Status: Published

Publication Type: Journal article, Original article

Publication year: 2015

Journal

Journal of Microelectronics and Electronic Packaging International Microelectronics And Packaging Society

Publisher: IMAPS-International Microelectronics and Packaging Society

Book Volume: 12

Pages Range: 61-66

Journal Issue: 1

DOI: 10.4071/imaps.445

Authors with CRIS profile

René Schramm Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Thomas Reitberger Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

How to cite

APA:

Schramm, R., Reitberger, T., & Franke, J. (2015). Electrical and mechanical investigations on copper circuit paths coated on fiber-reinforced plastics by atmospheric plasma technology. Journal of Microelectronics and Electronic Packaging, 12(1), 61-66. https://dx.doi.org/10.4071/imaps.445

MLA:

Schramm, René, Thomas Reitberger, and Jörg Franke. "Electrical and mechanical investigations on copper circuit paths coated on fiber-reinforced plastics by atmospheric plasma technology." Journal of Microelectronics and Electronic Packaging 12.1 (2015): 61-66.

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