Electrical and mechanical investigations on copper circuit paths coated on fiber-reinforced plastics by atmospheric plasma technology

Journal article
(Original article)


Publication Details

Author(s): Schramm R, Reitberger T, Franke J
Journal: Journal of Microelectronics and Electronic Packaging
Publisher: IMAPS-International Microelectronics and Packaging Society
Publication year: 2015
Volume: 12
Journal issue: 1
Pages range: 61-66
ISSN: 1551-4897
eISSN: 1555-8037


FAU Authors / FAU Editors

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Reitberger, Thomas
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Schramm, René
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


How to cite

APA:
Schramm, R., Reitberger, T., & Franke, J. (2015). Electrical and mechanical investigations on copper circuit paths coated on fiber-reinforced plastics by atmospheric plasma technology. Journal of Microelectronics and Electronic Packaging, 12(1), 61-66. https://dx.doi.org/10.4071/imaps.445

MLA:
Schramm, René, Thomas Reitberger, and Jörg Franke. "Electrical and mechanical investigations on copper circuit paths coated on fiber-reinforced plastics by atmospheric plasma technology." Journal of Microelectronics and Electronic Packaging 12.1 (2015): 61-66.

BibTeX: 

Last updated on 2018-23-11 at 20:50