Novel Approach for Implementation of 3D-MID Compatible Functionalities into Computer-Aided Design Tools

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Zeitler J, Fischer C, Goetze B, Franke J
Editor(s): Franke, Jörg; Kuhn, Thomas; Birkicht, Albert; Pojtinger, Andreas
Publisher: Trans Tech Publications Ltd
Publishing place: Pfaffikon
Publication year: 2014
Conference Proceedings Title: 11th International Congress Molded Interconnect Devices
ISBN: 9789038352525
Language: English


Abstract


Current Computer-Aided Design (CAD) tools offer a wide scope of functionality for design of mechatronic products. A number of electrical and mechanical CAD tools on the market fulfil demand in almost every application. Prevailing mechanical CAD tools offer besides simple geometric design also many advanced functionalities in the fields of Computer-Aided Engineering (CAE) or Manufacturing (CAM) to create for instance simulations for multi-physics or finite elements besides the simple shape design functionality. Electrical design tools on the other side contain part libraries for the schematic and geometric layout as well as automated routing algorithms with integrated design rule checks. Development within these two design tools often goes ahead simultaneously. However in the field of spatial electronic assemblies like 3D-MID (Moulded Interconnect Devices) a direct integration of the both disciplines is absolutely necessary. A 3D-MID application combines the conventional mechanical design and the electronic layout design on the same application. Therefore, for 3D-MID-design, ECAD (Electronic CAD) systems with the opportunity to create PCB layouts and MCAD (Mechanical CAD) systems with the functionality to design solid shapes have to be integrated into one single development environment. Existing tools allow import of geometrics from MCAD and schematics from ECAD to bring them together in the same environment. Nevertheless some specific functionalities like automated placement of conductor parts or the routing of tracks between them are still unsolved tasks. Due to the time consuming issue of these design domains a solution has to be found.

Our research work has the goal to merge the advantages of ECAD and MCAD design instead of developing a completely new software environment. For that approach a layer model was generated, which connects the different software tools to

a holistic picture. This should fulfil all requirements in the collaboration of electrical and mechanical design. Also technical restrictions like design and manufacturing rules have to be considered. Due to the nature of 3D-MID not only the electrical functionality is focussed but also the dependence with mechanical conditions. E.g. mechanical contact faces shouldn’t be permitted for electronic part placement or the routing of tracks. In order to realize all these functions a platform independent product model is created and implemented to generate a connection between these different systems and the implicit user knowledge. This product model builds a base for the routing and placement task of 3D-MID and further additional modules that can be implemented into the software structure to improve the scope of functionality. Within the current project that focusses a semi-automated routing, the user will be allowed to rip-up connections between the parts and to reroute with customized conditions by setting waypoints on the carrier surface. The routing will be semi-automated what means that not all connections will be routed at once to allow the user to have several options for the track planning. Finally, future challenges will be evaluated and further use of the results will be discussed in the paper.

 



FAU Authors / FAU Editors

Fischer, Christian
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Zeitler, Jochen
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


How to cite

APA:
Zeitler, J., Fischer, C., Goetze, B., & Franke, J. (2014). Novel Approach for Implementation of 3D-MID Compatible Functionalities into Computer-Aided Design Tools. In Franke, Jörg; Kuhn, Thomas; Birkicht, Albert; Pojtinger, Andreas (Eds.), 11th International Congress Molded Interconnect Devices. Fürth, DE: Pfaffikon: Trans Tech Publications Ltd.

MLA:
Zeitler, Jochen, et al. "Novel Approach for Implementation of 3D-MID Compatible Functionalities into Computer-Aided Design Tools." Proceedings of the 11th International Congress Molded Interconnect Devices (MID 2014), Fürth Ed. Franke, Jörg; Kuhn, Thomas; Birkicht, Albert; Pojtinger, Andreas, Pfaffikon: Trans Tech Publications Ltd, 2014.

BibTeX: 

Last updated on 2018-07-08 at 22:32