Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)

Beitrag in einer Fachzeitschrift
(Originalarbeit)


Details zur Publikation

Autor(en): Glocker E, Boppu S, Chen Q, Schlichtmann U, Teich J, Schmitt-Landsiedel D
Zeitschrift: Advances in Radio Science
Jahr der Veröffentlichung: 2014
Band: 12
Seitenbereich: 103-109
ISSN: 1684-9973


Abstract


This contribution provides an approach for emulating the behaviour of an ASIC temperature monitoring system (TMon) during run-time for a tightly-coupled processor array (TCPA) of a heterogeneous invasive multi-tile architecture to be used for FPGA prototyping. It is based on a thermal RC modeling approach. Also different usage scenarios of TCPA are analyzed and compared.



FAU-Autoren / FAU-Herausgeber

Boppu, Srinivas
Sonderforschungsbereich/Transregio 89 Invasives Rechnen
Teich, Jürgen Prof. Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)


Autor(en) der externen Einrichtung(en)
Technische Universität München (TUM)


Zitierweisen

APA:
Glocker, E., Boppu, S., Chen, Q., Schlichtmann, U., Teich, J., & Schmitt-Landsiedel, D. (2014). Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs). Advances in Radio Science, 12, 103-109. https://dx.doi.org/10.5194/ars-12-103-2014

MLA:
Glocker, E., et al. "Temperature modeling and emulation of an ASIC temperature monitor system for Tightly-Coupled Processor Arrays (TCPAs)." Advances in Radio Science 12 (2014): 103-109.

BibTeX: 

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