Biber S, Schür J, Hofmann A, Schmidt LP (2004)
Publication Language: English
Publication Type: Conference contribution
Publication year: 2004
Edited Volumes: Fifth International Kharkov Symposium on Physics and Engineering of Microwaves, Millimeter, and Submillimeter Waves - Symposium Proceedings, MSMW'04
Pages Range: 26-31
Conference Proceedings Title: Proc. of Kharkov Symposium on Physics and Engineering of Microwaves, Millimeter and Submillimeter Waves, Kharkov, Ukraine, June
Event location: Kharkov
DOI: 10.1109/MSMW.2004.1345782
We present an overview on the latest results using micromachining techniques far the fabrication of THz-components. Different machining techniques will be discussed with respect to their capability to generate complex 3-dimensional geometries with high aspect ratios and to meet the high mechanical requirements for THz-components. Exemplary results for the application of micromachining techniques for the design of new components will be reviewed. We will emphasize the potential of silicon based microstructures for the manufacturing of new devices.
APA:
Biber, S., Schür, J., Hofmann, A., & Schmidt, L.-P. (2004). Design of New Passive THz Devices based on Micromachining Techniques. In Proc. of Kharkov Symposium on Physics and Engineering of Microwaves, Millimeter and Submillimeter Waves, Kharkov, Ukraine, June (pp. 26-31). Kharkov.
MLA:
Biber, Stephan, et al. "Design of New Passive THz Devices based on Micromachining Techniques." Proceedings of the Fifth International Kharkov Symposium on Physics and Engineering of Microwaves, Millimeter, and Submillimeter Waves - Symposium Proceedings, MSMW'04, Kharkov 2004. 26-31.
BibTeX: Download