Four-port on Wafer Measurement of Coupled Transmission Lines on LTCC

Ziegler C, Nisznansky M, Schmidt LP, Hocke R, Wohlgemuth O (2003)


Publication Language: English

Publication Type: Conference contribution

Publication year: 2003

Journal

Publisher: International Society for Optical Engineering; 1999

Edited Volumes: Proceedings of SPIE - The International Society for Optical Engineering

Pages Range: 107-112

Conference Proceedings Title: Proceedings of IMAPS Conference and Exhibition on Ceramic Interconnect Technology

Event location: Denver, Colorado, USA

Abstract

The measurement results of coupled transmission lines on LTCC multilayer substrates are presented in this paper. The S-parameters of 4-port devices have been measured using a newly developed topology of a multiport vector network analyzer (VNA). A method for a multiport calibration based on multiple 2-port TRL-calibration routines is presented. The procedure has been developed for the use of a wafer probe station with coupled probe tips in combination with the 4-port VNA. To extract information about the capabilities of the measurement system, the measured data of the coupled microstrip lines on LTCC are compared to the results of a numerical circuit simulation of these lines. The measured single-ended S-parameters were transformed to a modal description by matrix transformation, describing the characteristics of the measured devices at common-mode or differential-mode stimulus. The results of the measurements and simulations will be discussed.

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How to cite

APA:

Ziegler, C., Nisznansky, M., Schmidt, L.-P., Hocke, R., & Wohlgemuth, O. (2003). Four-port on Wafer Measurement of Coupled Transmission Lines on LTCC. In Proceedings of IMAPS Conference and Exhibition on Ceramic Interconnect Technology (pp. 107-112). Denver, Colorado, USA: International Society for Optical Engineering; 1999.

MLA:

Ziegler, Christof, et al. "Four-port on Wafer Measurement of Coupled Transmission Lines on LTCC." Proceedings of the Ceramic Interconnect Technology: The Next Generation, Denver, Colorado, USA International Society for Optical Engineering; 1999, 2003. 107-112.

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