Mechatronic Integrated Devices Produced by Laser Direct Structuring on Powder-Coated Aluminum Substrates

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(Konferenzbeitrag)


Details zur Publikation

Autorinnen und Autoren: Kuhn T, Krügelstein A, Franke J
Herausgeber: IEEE
Jahr der Veröffentlichung: 2016
Tagungsband: Proceedings of 39th International Spring Seminar on Electronics Technology (ISSE 2016)
Seitenbereich: 27--32


Abstract


The present study aims to display new potentials for Mechatronic Integrated Devices (MID) by using a powder coating system (PCS) that enables the laser direct structuring process (LDS) on metal-based substrates. Therefore, in a first step, relevant process parameters for the production of MID based on powder-coated aluminum plates were identified. Afterwards, comparative investigations between powder-coated specimen and conventional thermoplastic LDS-MID using liquid crystal polymer (LCP) and thermally conductive polyamide (PA mXD6) as substrate material were executed. The results show clear advantages of the powder-coated parts regarding current carrying capacity of circuit traces. Furthermore, the mechanical characterization of the different specimen indicates considerably higher adhesion strength between metallization and powder coating than between metallization and the investigated thermoplastic materials.



FAU-Autorinnen und Autoren / FAU-Herausgeberinnen und Herausgeber

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Krügelstein, Andreas
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Kuhn, Thomas
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


Zitierweisen

APA:
Kuhn, T., Krügelstein, A., & Franke, J. (2016). Mechatronic Integrated Devices Produced by Laser Direct Structuring on Powder-Coated Aluminum Substrates. In IEEE (Eds.), Proceedings of 39th International Spring Seminar on Electronics Technology (ISSE 2016) (pp. 27--32).

MLA:
Kuhn, Thomas, Andreas Krügelstein, and Jörg Franke. "Mechatronic Integrated Devices Produced by Laser Direct Structuring on Powder-Coated Aluminum Substrates." Proceedings of the Proceedings of 39th International Spring Seminar on Electronics Technology (ISSE 2016) Ed. IEEE, 2016. 27--32.

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