Mechatronic Integrated Devices Produced by Laser Direct Structuring on Powder-Coated Aluminum Substrates

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Kuhn T, Krügelstein A, Franke J
Editor(s): IEEE
Publication year: 2016
Conference Proceedings Title: Proceedings of 39th International Spring Seminar on Electronics Technology (ISSE 2016)
Pages range: 27--32


Abstract


The present study aims to display new potentials for Mechatronic Integrated Devices (MID) by using a powder coating system (PCS) that enables the laser direct structuring process (LDS) on metal-based substrates. Therefore, in a first step, relevant process parameters for the production of MID based on powder-coated aluminum plates were identified. Afterwards, comparative investigations between powder-coated specimen and conventional thermoplastic LDS-MID using liquid crystal polymer (LCP) and thermally conductive polyamide (PA mXD6) as substrate material were executed. The results show clear advantages of the powder-coated parts regarding current carrying capacity of circuit traces. Furthermore, the mechanical characterization of the different specimen indicates considerably higher adhesion strength between metallization and powder coating than between metallization and the investigated thermoplastic materials.



FAU Authors / FAU Editors

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Krügelstein, Andreas
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Kuhn, Thomas
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


How to cite

APA:
Kuhn, T., Krügelstein, A., & Franke, J. (2016). Mechatronic Integrated Devices Produced by Laser Direct Structuring on Powder-Coated Aluminum Substrates. In IEEE (Eds.), Proceedings of 39th International Spring Seminar on Electronics Technology (ISSE 2016) (pp. 27--32).

MLA:
Kuhn, Thomas, Andreas Krügelstein, and Jörg Franke. "Mechatronic Integrated Devices Produced by Laser Direct Structuring on Powder-Coated Aluminum Substrates." Proceedings of the Proceedings of 39th International Spring Seminar on Electronics Technology (ISSE 2016) Ed. IEEE, 2016. 27--32.

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Last updated on 2018-19-10 at 16:40