Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit Carriers

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Details zur Publikation

Autorinnen und Autoren: Syed Khaja AH, Kästle C, Franke J
Jahr der Veröffentlichung: 2016
Tagungsband: Proceedings of the 49th International Symposium on Microelectronics
Seitenbereich: 517 - 522
Sprache: Englisch


Abstract


The introduction of new generation semiconductor materials into power electronics brings not only performance improvements but also technological challenges for the thermal management as the urge for high temperature operating power modules and packaging systems increases. The limiting factor for the performance and application range is not anymore the chip temperatures but the restrictions of the state-of-the-art packaging systems. Especially for high power applications, the temperatures can rise to more than 200 °C at the interconnect level. In this paper, as a contribution towards the above requirements, the selective laser melting (SLM) technique has been used to fabricate a heat sink concept which would not be feasible with conventional production techniques. Here the feasibility of producing a heat sink concept with SLM based on micro-cooling technology is successfully introduced and the thermal management performance is demonstrated. The advantages mainly for the volume and weight reduction along with performance improvement are highlighted.



FAU-Autorinnen und Autoren / FAU-Herausgeberinnen und Herausgeber

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Kästle, Christopher
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


Zitierweisen

APA:
Syed Khaja, A.H., Kästle, C., & Franke, J. (2016). Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit Carriers. In Proceedings of the 49th International Symposium on Microelectronics (pp. 517 - 522). Pasadena, US.

MLA:
Syed Khaja, Aarief Hussain, Christopher Kästle, and Jörg Franke. "Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit Carriers." Proceedings of the Electronic Components and Technology Conference, Pasadena 2016. 517 - 522.

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Zuletzt aktualisiert 2018-06-08 um 23:12