Adhesive bonding between multi-material assembly injection molding parts with an adhesive interlayer

Beitrag in einer Fachzeitschrift

Details zur Publikation

Autorinnen und Autoren: Heinle M, Heinle C, Drummer D, Amesöder S
Zeitschrift: Journal of Polymer Engineering
Verlag: Freund Publishing House Ltd
Jahr der Veröffentlichung: 2011
Band: 31
Heftnummer: 8-9
Seitenbereich: 539-548
ISSN: 0334-6447


As it o ffers a wide range of benefi ts, assembly injection molding of plastics represents an innovative technology. In a material, cost effi cient and integrative process, the most diverse products for mechatronics applications can be manufactured. The technique can generate multi-material systems combining different parts with special functionality, e.g., plastics casings and circuit boards, in a fully automated process. This automated integration of part structure and functionality makes these products superior to others. However, it implies a great challenge in terms of technology for part development and production. Of vital importance for a media tight and durable connection between individual materials/parts of the assembly, are factors such as the components ' compatibility and chemical-physical adhesion. Thermal stress in hybrid assemblies due to different thermal expansion coeffi cients is often the reason for part failure. An approach to meeting these challenges is the investigation of the process-integrated application of functional interlayers, in order to improve the formation of adhesion along with the optimization of the stress distribution. The following article will present fi ndings obtained on the bond strength generated by different types of interlayers (hot-melt and pressure-sensitive adhesives) between circuit cards and different types of casing plastics. A fundamental understanding of underlying effects and the tools for predicting process dependent effects is required for the optimization of the systems ' functionality. For this purpose, the interactions between material, system design and process conditions are considered in relation to bond strength. © 2011 by Walter de Gruyter Berlin Boston.

FAU-Autorinnen und Autoren / FAU-Herausgeberinnen und Herausgeber

Drummer, Dietmar Prof. Dr.-Ing.
Lehrstuhl für Kunststofftechnik
Heinle, Martina
Lehrstuhl für Kunststofftechnik


Heinle, M., Heinle, C., Drummer, D., & Amesöder, S. (2011). Adhesive bonding between multi-material assembly injection molding parts with an adhesive interlayer. Journal of Polymer Engineering, 31(8-9), 539-548.

Heinle, Martina, et al. "Adhesive bonding between multi-material assembly injection molding parts with an adhesive interlayer." Journal of Polymer Engineering 31.8-9 (2011): 539-548.


Zuletzt aktualisiert 2018-11-08 um 02:55