Stress-Aware Module Placement on Reconfigurable Devices

Beitrag bei einer Tagung


Details zur Publikation

Autor(en): Angermeier J, Ziener D, Glaß M, Teich J
Titel Sammelwerk: Proceedings - 21st International Conference on Field Programmable Logic and Applications, FPL 2011
Verlag: IEEE Computer Society
Verlagsort: New York, NY, USA
Jahr der Veröffentlichung: 2011
Tagungsband: Proceedings of the International Conference on Field-Programmable Logic and Applications
Seitenbereich: 277-281
ISBN: 978-1-4577-1484-9


Abstract


A lot of research has been spent on improving the reliability and extending the lifetime of ASIC and SoC devices, but only little on improving the long-term reliability of dynamically reconfigurable systems. In order to increase the lifetime of a reconfigurable device, we propose a placement strategy to distribute the stress equally on the reconfigurable resources at runtime such that all have a similar level of degradation. Thereby, we present a new aging model which is applied to estimate the influence of aging effects on dynamically reconfigurable devices, and which can be evaluated at runtime, while providing quite accurate aging results. Furthermore, we present a new stress-aware placement algorithm that takes the degradation of the reconfigurable resources into account and can significantly extend the lifetime of reconfigurable devices. © 2011 IEEE.



FAU-Autoren / FAU-Herausgeber

Angermeier, Josef Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)
Glaß, Michael Prof. Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)
Teich, Jürgen Prof. Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)
Ziener, Daniel Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)


Zitierweisen

APA:
Angermeier, J., Ziener, D., Glaß, M., & Teich, J. (2011). Stress-Aware Module Placement on Reconfigurable Devices. In Proceedings of the International Conference on Field-Programmable Logic and Applications (pp. 277-281). Chania, Crete, GR: New York, NY, USA: IEEE Computer Society.

MLA:
Angermeier, Josef, et al. "Stress-Aware Module Placement on Reconfigurable Devices." Proceedings of the International Conference on Field Programmable Logic and Applications (FPL'11), Chania, Crete New York, NY, USA: IEEE Computer Society, 2011. 277-281.

BibTeX: 

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