Using boron doped diamond foils for fabrication of micro cavities with EDM

Beitrag bei einer Tagung
(Konferenzbeitrag)


Details zur Publikation

Autor(en): Uhlmann E, Langmack M, Fecher J, Rosiwal S, Singer R
Verlag: euspen
Jahr der Veröffentlichung: 2013
Band: 1
Seitenbereich: 264-267
ISBN: 9780956679024


Abstract


High precision cavities come into action for micro injection and micro embossing tools in the field of tool making and are mainly used for small batch or mass production of micro parts. To fabricate a large quantity of parts, wear resistant tool materials are required. Having a high hardness and a high Young's Modulus, the materials used are often heavy or even impossible to machine by conventional fabrication processes. Being independent of the work piece's mechanical properties Micro Electrical Discharge Machining (μEDM) is predestined in this case. Besides the adjustment of the electrical parameters, the μEDM-process is also determined by the tool electrode's material having a big influence on the machining time, the result, and the electrode's wear behaviour [1]. To assure an efficient process, short production time and a low tool wear are demanded. Therefore, electrodes with an excellent electrical and thermal conductivity as well as a high mechanical strength have to be used.



FAU-Autoren / FAU-Herausgeber

Fecher, Jonas
Lehrstuhl für Werkstoffwissenschaften (Werkstoffkunde und Technologie der Metalle)
Rosiwal, Stefan PD Dr.-Ing.
Lehrstuhl für Werkstoffwissenschaften (Werkstoffkunde und Technologie der Metalle)
Singer, Robert Prof. Dr.-Ing.
Lehrstuhl für Werkstoffwissenschaften (Werkstoffkunde und Technologie der Metalle)


Autor(en) der externen Einrichtung(en)
Technische Universität Berlin


Zitierweisen

APA:
Uhlmann, E., Langmack, M., Fecher, J., Rosiwal, S., & Singer, R. (2013). Using boron doped diamond foils for fabrication of micro cavities with EDM. (pp. 264-267). euspen.

MLA:
Uhlmann, Eckart, et al. "Using boron doped diamond foils for fabrication of micro cavities with EDM." Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 euspen, 2013. 264-267.

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Zuletzt aktualisiert 2018-06-08 um 19:56