Process development for the manufacturing of 99.94% pure copper via selective electron beam melting

Beitrag in einer Fachzeitschrift
(Originalarbeit)


Details zur Publikation

Autor(en): Lodes M, Guschlbauer R, Körner C
Zeitschrift: Materials Letters
Verlag: Elsevier
Jahr der Veröffentlichung: 2015
Band: 143
Seitenbereich: 298-301
ISSN: 1873-4979
Sprache: Englisch


Abstract


The additive processing of 99.94% pure copper powder via selective electron beam melting (SEBM) is presented. The high thermal and electrical conductivity of pure copper combined with the freedom in design in additive manufacturing is promising for future application e.g. as heat exchanger. A process window for the generation of dense copper parts could be evaluated. Despite the high thermal conductivity, comparatively low build temperatures have to be used due to the high sintering tendency of the powder. The latter also limits the maximum power input during melting.



FAU-Autoren / FAU-Herausgeber

Guschlbauer, Ralf
Zentralinstitut für Neue Materialien und Prozesstechnik
Körner, Carolin Prof. Dr.-Ing.
Lehrstuhl für Werkstoffwissenschaften (Werkstoffkunde und Technologie der Metalle)
Lodes, Matthias Dr.-Ing.
Zentralinstitut für Neue Materialien und Prozesstechnik


Zitierweisen

APA:
Lodes, M., Guschlbauer, R., & Körner, C. (2015). Process development for the manufacturing of 99.94% pure copper via selective electron beam melting. Materials Letters, 143, 298-301. https://dx.doi.org/10.1016/j.matlet.2014.12.105

MLA:
Lodes, Matthias, Ralf Guschlbauer, and Carolin Körner. "Process development for the manufacturing of 99.94% pure copper via selective electron beam melting." Materials Letters 143 (2015): 298-301.

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