Process development for the manufacturing of 99.94% pure copper via selective electron beam melting

Lodes M, Guschlbauer R, Körner C (2015)

Publication Language: English

Publication Status: Published

Publication Type: Journal article, Original article

Publication year: 2015

Journal

Materials Letters Elsevier

Publisher: Elsevier

Book Volume: 143

Pages Range: 298-301

DOI: 10.1016/j.matlet.2014.12.105

Abstract

The additive processing of 99.94% pure copper powder via selective electron beam melting (SEBM) is presented. The high thermal and electrical conductivity of pure copper combined with the freedom in design in additive manufacturing is promising for future application e.g. as heat exchanger. A process window for the generation of dense copper parts could be evaluated. Despite the high thermal conductivity, comparatively low build temperatures have to be used due to the high sintering tendency of the powder. The latter also limits the maximum power input during melting.

Authors with CRIS profile

Matthias Lodes Zentralinstitut für Neue Materialien und Prozesstechnik Ralf Guschlbauer Zentralinstitut für Neue Materialien und Prozesstechnik Carolin Körner Lehrstuhl für Werkstoffwissenschaften (Werkstoffkunde und Technologie der Metalle)

Related research project(s)

Activity Development of SEBM alloys Jan. 1, 2000 - Jan. 1, 2003 Activity SEBM of special alloys Jan. 1, 2000 - Jan. 1, 2003

How to cite

APA:

Lodes, M., Guschlbauer, R., & Körner, C. (2015). Process development for the manufacturing of 99.94% pure copper via selective electron beam melting. Materials Letters, 143, 298-301. https://dx.doi.org/10.1016/j.matlet.2014.12.105

MLA:

Lodes, Matthias, Ralf Guschlbauer, and Carolin Körner. "Process development for the manufacturing of 99.94% pure copper via selective electron beam melting." Materials Letters 143 (2015): 298-301.

BibTeX: Download