A Large Deflection Model of Silicon Membranes for Testing Intrinsic Stress of MEMS Microphones by Measuring Pull-In Voltage

Oesterle F, Fink F, Dehe A, Kuhn H, Weigel R, Kölpin A (2013)


Publication Type: Conference contribution

Publication year: 2013

Publisher: SPIE

Book Volume: 8763

Event location: Grenoble FR

DOI: 10.1117/12.2016835

Abstract

Mechanical parameters, especially mechanical stress of membranes used in silicon microphones strongly depend on the manufacturing process. As a result, deviations during this process can result in sensitivity variations of the microphone. Therefore, the stress should be well controlled within a certain tensile level. This paper describes a method to test devices electrically using the MEMS related pull-in phenomenon with respect to the mechanical compliance of microphone membranes. Using this method, out of specification chips can be detected at an early stage within the manufacturing process instead of determination at a system functionality test after packaging. Therefore, the adequacy for the intended use of the pull-in voltage and its dependency on varying tensile stress due to manufacturing tolerance is evaluated.

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How to cite

APA:

Oesterle, F., Fink, F., Dehe, A., Kuhn, H., Weigel, R., & Kölpin, A. (2013). A Large Deflection Model of Silicon Membranes for Testing Intrinsic Stress of MEMS Microphones by Measuring Pull-In Voltage. In Proceedings of the SPIE Microtechnologies, Smart Sensors, Actuators, and MEMS VI, Conference 8763. Grenoble, FR: SPIE.

MLA:

Oesterle, Florian, et al. "A Large Deflection Model of Silicon Membranes for Testing Intrinsic Stress of MEMS Microphones by Measuring Pull-In Voltage." Proceedings of the SPIE Microtechnologies, Smart Sensors, Actuators, and MEMS VI, Conference 8763, Grenoble SPIE, 2013.

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