Characterization and reliability of paste based thin-film Sn-Cu TLPS joints for high temperature power electronics

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Syed Khaja AH, Franke J
Publisher: Institute of Electrical and Electronics Engineers Inc.
Publication year: 2015
ISBN: 9783800739240
Language: English


Abstract


Electro-mobility plays an important role in addressing the fuel efficiency and emission requirements, as well as the market demands for low operational costs. Power electronics which is a key technology in electro-mobility motivates the present work. This paper gives an overview of the optimization of the present state-of-The-Art soldering technologies for diffusion soldering in power electronics, in particular for Transient Liquid Phase Soldering (TLPS) capable of producing die-Attach interconnections with remelt temperatures >400°C. The material characterization and reliability analysis of this thin-film Sn-Cu paste-based TLPS technology is discussed. For demonstration purposes, power modules had been constructed with solder pastes developed for TLPS process. High temperature shear tests up to 500°C and accelerated reliability tests have been performed to explain the possible microstructural defects and failure modes.



FAU Authors / FAU Editors

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


How to cite

APA:
Syed Khaja, A.H., & Franke, J. (2015). Characterization and reliability of paste based thin-film Sn-Cu TLPS joints for high temperature power electronics. Institute of Electrical and Electronics Engineers Inc..

MLA:
Syed Khaja, Aarief Hussain, and Jörg Franke. "Characterization and reliability of paste based thin-film Sn-Cu TLPS joints for high temperature power electronics." Proceedings of the 2015 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2015 Institute of Electrical and Electronics Engineers Inc., 2015.

BibTeX: 

Last updated on 2018-10-08 at 11:38