Patterning of OPV modules by ultra-fast laser

Kubis P, Lucera L, Guo F, Spyropoulos G, Voigt M, Brabec C (2014)

Publication Language: English

Publication Status: Published

Publication Type: Conference contribution, Conference Contribution

Publication year: 2014

Publisher: SPIE

Book Volume: 9180

Article Number: 91800M

Event location: San Diego US

ISBN: 9781628412079

DOI: 10.1117/12.2060570

Abstract

A novel production process combining slot-die coating, transparent exible IMI (ITO-Metal-ITO) electrodes and ultra-fast laser ablation can be used for the realization of P3HT:PCBM based thin film exible OPV modules. The fast and precise laser ablation allows an overall efficiency over 3 % and a device geometric fill factor (GFF) over 95 %. Three functional layers can be ablated using the same wavelength only with varying the laser uence and overlap. Different OPV device architectures with multilayers utilizing various materials are challenging for ablation but can be structured by using a systematical approach.

Authors with CRIS profile

Peter Kubis Institute Materials for Electronics and Energy Technology (i-MEET) Fei Guo Institute Materials for Electronics and Energy Technology (i-MEET) Georgios Spyropoulos Institute Materials for Electronics and Energy Technology (i-MEET) Monika Voigt Institute Materials for Electronics and Energy Technology (i-MEET) Christoph Brabec Institute Materials for Electronics and Energy Technology (i-MEET)

How to cite

APA:

Kubis, P., Lucera, L., Guo, F., Spyropoulos, G., Voigt, M., & Brabec, C. (2014). Patterning of OPV modules by ultra-fast laser. In Proceedings of the Laser Processing and Fabrication for Solar, Displays, and Optoelectronic Devices III. San Diego, US: SPIE.

MLA:

Kubis, Peter, et al. "Patterning of OPV modules by ultra-fast laser." Proceedings of the Laser Processing and Fabrication for Solar, Displays, and Optoelectronic Devices III, San Diego SPIE, 2014.

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