Small form factor and low profile quad-band System-in-Package (SiP) module

Shevelov M, Sieroshtan V, Ruban O, Burygin A, Komakha P, Aleksieiev O, Chayka O, Sevskiy G, Stoehr P, Heide P, Vossiek M (2011)

Publication Language: English

Publication Type: Conference contribution

Publication year: 2011

Publisher: Institute of Electrical & Electronics Engineers (IEEE)

Event location: Baltimore US

ISBN: 978-1-61284-757-3

DOI: 10.1109/MWSYM.2011.5972704

Abstract

A very small form factor and low profile quad-band System-in-Package (SiP) module based on the state-of-the-art brand new 65nm CMOS IC is presented. The SiP module provides full function of 2.4G and 5G WLAN, Bluetooth, GPS, FM radio and FM transmitter. The highly integrated device incorporates single chip, RF front-end module, filters for dual band WLAN and GPS, number of SMD components and metal case which provides mechanical protection and implements EMI shielding. A laminate substrate provides the interconnection and distribution of the signals and ground to various components and acts as the carrier to support the die and allow the die IOs to be distributed to the package IOs. Very compact SiP solution with dimensions of 9.5×11.9×1.2mm3 forms a complete stand-alone multi functional wireless communication system.

Authors with CRIS profile

Martin Vossiek Lehrstuhl für Hochfrequenztechnik

Involved external institutions

EPCOS AG DE Germany (DE)

How to cite

APA:

Shevelov, M., Sieroshtan, V., Ruban, O., Burygin, A., Komakha, P., Aleksieiev, O.,... Vossiek, M. (2011). Small form factor and low profile quad-band System-in-Package (SiP) module. In Proceedings of the IEEE International Microwave Symposium 2011. Baltimore, US: Institute of Electrical & Electronics Engineers (IEEE).

MLA:

Shevelov, Mykola, et al. "Small form factor and low profile quad-band System-in-Package (SiP) module." Proceedings of the IEEE International Microwave Symposium 2011, Baltimore Institute of Electrical & Electronics Engineers (IEEE), 2011.

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