Additive Plasma Metallization of Spatial Ceramic Injection Molded Components

Braun T, Greiner S, Franke J, Drummer D (2016)


Publication Type: Conference contribution, Original article

Publication year: 2016

Publisher: Institute of Electrical and Electronics Engineers Inc.

Edited Volumes: 2016 12th International Congress Molded Interconnect Devices - Scientific Proceedings, MID 2016

Pages Range: 62-67

Conference Proceedings Title: 12th International Congress Molded Interconnect Devices (MID): Scientific Proceedings

Event location: Würzburg

ISBN: 9781509054282

DOI: 10.1109/ICMID.2016.7738930

Authors with CRIS profile

How to cite

APA:

Braun, T., Greiner, S., Franke, J., & Drummer, D. (2016). Additive Plasma Metallization of Spatial Ceramic Injection Molded Components. In 12th International Congress Molded Interconnect Devices (MID): Scientific Proceedings (pp. 62-67). Würzburg: Institute of Electrical and Electronics Engineers Inc..

MLA:

Braun, Thomas, et al. "Additive Plasma Metallization of Spatial Ceramic Injection Molded Components." Proceedings of the 12th International Congress Molded Interconnect Devices, Würzburg Institute of Electrical and Electronics Engineers Inc., 2016. 62-67.

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