A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications

Beitrag in einer Fachzeitschrift


Details zur Publikation

Autorinnen und Autoren: Syed Khaja AH, Kästle C, Müller M, Franke J
Zeitschrift: Applied Mechanics and Materials
Jahr der Veröffentlichung: 2015
Heftnummer: 794
Seitenbereich: 320 - 327
ISSN: 1660-9336
Sprache: Englisch


Abstract


The field of power electronics packaging presents intricate and interdisciplinary challenges. System costs, reliability and performance are strongly determined by various aspects such as mechanical design, materials, thermal management and interconnect technologies. The overall costs of the product depend mainly on the complete process chain in the module development. Automation as well plays an important role and facilitates higher production rates, efficient use of materials, better product quality, and reduced factory lead times. This paper focuses on emerging interconnection technologies of bonding semiconductor components to power electronic substrates like diffusion soldering, conductive adhesive bonding and reactive multi-layer bonding. An overview on the automation potentials and complexities in individual technologies for the manufacturing of reliable and cost-effective power modules is given and discussed. Thus, a basis is created for choosing optimal die-attach technology depending on economic and technologic demand by comparing the state-of-the-art and advanced technologies.



FAU-Autorinnen und Autoren / FAU-Herausgeberinnen und Herausgeber

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Kästle, Christopher
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Müller, Martin
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


Zitierweisen

APA:
Syed Khaja, A.H., Kästle, C., Müller, M., & Franke, J. (2015). A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications. Applied Mechanics and Materials, 794, 320 - 327. https://dx.doi.org/10.4028/www.scientific.net/AMM.794.320

MLA:
Syed Khaja, Aarief Hussain, et al. "A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications." Applied Mechanics and Materials 794 (2015): 320 - 327.

BibTeX: 

Zuletzt aktualisiert 2018-11-08 um 02:25